• • • Acids

Ultra Pure Chemicals

Acids

• Acetic Acid Glacial
• Ammonium Fluoride 40%
• Hydrochloric Acid 37%
• Dilute Hydrofluoric 10%, 4.9%, 1%
• Hydrofluoric Acid

• Nitric Acid
• Nitric Acid 97% - 99% (Fuming)
• Phosphoric Acid 86%; 80%
• Sulphuric Acid 96%

Hydrochloric Acid 37%

Hydrochloric Acid may be mixed with Hydrogen Peroxide and De-ionised Water to be used during the RCA or SC2 cleaning processes (Typical Ratio ; HCl : H2O2 : DIH2O , 1 : 1 : 10).Typically the bath temperature is around 30°C. This mixture forms an oxidising acid environment which facilitates the removal of metals from silicon surfaces. In addition, Hydrochloric Acid 37% may be used to etch ITO layers when mixed with Nitric Acid and Deionised Water.

Market Segments:

• Semiconductor
• MEMS & Nanotechnology
• PV/Solar

Functions:

Cleaner, Etchant