Ultra Pure Chemicals
Oxidisers
Hydrogen Peroxide 31%
Hydrogen Peroxide may be used as the oxidant of the SC1 cleans (mixed with Ammonia) and as the oxidant of the SC2 clean (mixed with Hydrochloric Acid). Hydrogen Peroxide may also be mixed with Sulphuric Acid to strip resist from non-metal substrates and non-metal layers or also to remove organics and metals from substrates prior to furnace processing or layer deposition. Diluted with De-ionised Water, Hydrogen Peroxide may be used as an etch for TiW..
Market Segments:
Functions:
Cleaner, Resist Stripper, Etchant