Electronic Chemicals
Printed Circuit Board
Specialty Processes
The NICKELSOL process is a hydrogen peroxide-sulfuric acid formulation designed to strip nickel and copper from aluminum, plastic and stainless steel. The process will also remove electroless nickel deposits from printed wiring boards while leaving the underlying copper in a virtually pristine state, thus allowing the printed board to be reprocessed through electroless nickel.
Defoamers
Our PD-550 is an efficient non-silicone based defoamer that is particularly used in dry film / ink stripping and photo-imageable solder mask developing. Specifically formulated to resolve foam problem, its formulation is ideal for use in conveyorized spraying machines without adversely affecting the equipment.
MECetchBond Chemistry
MECetchBond CZ-8100 series are an organic acid-based micro-etching chemicals that create roughened chemistry topography of peaks and valleys, which will provide a higher adhesion. They have wide applications in areas like prior to build-up resin lamination, prior to dry film lamination and prior to solder resist coating. When applying together with MECetchBond CL-8300 series adhesion promoter, better adhesion to high Tg materials and hygroscopic resin can be obtained.
Micro-etching Chemistry
MECBRITE CB-800P / CB-5002 is H2SO4 – H2O2 type microetchant to treat a copper surface. It can be used prior to application of dry film, solder mask, hot air leveling and OSP.
Half Etch Chemistry
MEC PowerEtch Chemistry is a Sulfuric Acid / Hydrogen Peroxide etchant that improves the precision of fire patterns by reducing copper foil thickness evenly. Stable concentration of Hydrogen Peroxide and easy control of etching amounts are advantages.
Metal Resist Stripping
MEC Tin / Tin Lead Stripper S-1728X is a non-fluoride, non-peroxide stripper.
The advantages are a fast stripping rate, simple waste treatment, no measling and less sludge.
Lead Free Hot Air Leveling Flux
Shikoku Glicoat SMD F2LX is an acetic acid based solution containing a substituted imidazole MEC Hot Air Leveling Flux W series are exclusively developed for use with lead-free solder; such as Sn-Ag-Cu and Sg-Zn solders. It improves solderability with its excellent heat resistance and solder wettability.
Organic Solderable Pre-flux
MECSEAL CL-5018 improves solderability by forming an anti-tarnish film that has excellent resistance to heat and moisture. CL-5018 is suitable for soldering with lead-free solder. (e.g. Sn-3.0Ag–0.5 Cu)
For more information, please visit the MEC website: http://www.mec-co.com
