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Printed Circuit Board Overview

• Final Finishes
• Inner Layer Processes
• Making Holes Conductive

• Outer Layer Processes
• Photovoltaic Industry

• Plating 3D
• Specialty Processes

A world class provider of a total process solution for your circuit board manufacturing needs:

• Global manufacturing footprint to meet the diverse needs of the electronics industry supply chain. Our manufacturing facilities are located in strategic areas of the globe to provide uninterrupted process chemistry to our customer base. We operate manufacturing and technical service facilities in Kuching, Malaysia; Chungli, Taiwan; Suzhou, China; Singapore and Maple Plain, Minnesota.
• While our manufacturing reach is extensive, we also focus on our direct service model through a team of dedicated engineers and other associates. These teams create value for our customers due to rapid response, on-site service and customized solutions for the printed circuit board fabricator.
• Excellence in technical service not withstanding, we pride ourselves in developing innovative processes that allow our customers to enhance the quality and reliability of the finished product while at the same time, reducing the overall costs associated with circuit board fabrication.
• The future of the printed circuit industry means that printed circuit boards are becoming ever more dense, with smaller vias and finer lines and spaces. This inevitable movement towards increased complexity presents significant challenges for our customers. We rise to the occasion and provide a total solution that helps our customers meet these challenges with a comprehensive offering of auto-catalytic and electroplating processes.
• With the need to provide RoHS compliant processes for printed circuit board manufacturing, we develop and market a complete package of lead-free final finishes and other processes required to meet stringent regulatory requirements.

We bring technical expertise to the printed circuit board manufacturing process and focus our resources on:

• The Move to HDI (High Density Interconnection)
  - a completely new generation of PWB technology and processes
• The adoption of PWB technology as the Interposer level in Chip Carriers - a fundamentally new role for PWB technology
• The adoption of microvias
  - mechanical drilling moves over, replaced by laser
• New laminates and board materials
  - boards to survive higher temperatures and vibrations
  - portable communications and automotive controls
• High performance resins require advanced chemistry to ensure proper desmear and hole wall surface preparation
  - thin traces, deep high aspect ratio holes
  - electrodeposition technology achieves high placement rates
• Pulse plating ensures high speed and regular metallization
  - universal plating distribution and throwing power are critical
• Expanding our market space to serve new technologies such as solar cell panel production