Electronic Chemicals
Electronic Packaging and Finishing Technologies
OMG Lead Free Plating Processes
| Process | Alloy | Feature/Benefit |
| Methane Sulfonate Pure Tin Technology | ||
| 2544 | 100% Sn - Pure Tin Application: Matte/Satin Finish: Reel-to-reel plating of semiconductor lead frames, connectors, contacts, wire, flat stock. Rack and barrel plating of connectors, contacts and miscellaneous parts. |
• very wide current density range • great throwing power • excellent solderability • uniform deposit appearance • low carbon content |
| 2544LF | 100% Sn - Pure Tin Application: Matte/Satin Finish: Reel-to-reel plating of semiconductor lead frames, connectors, contacts, wire, flat stock. Rack and barrel plating of connectors, contacts and miscellaneous parts. |
• low foaming • unique controlled grain size and morphology • low stress • very low carbon content • additives are analyzable • excellent solderability |
| 100% Sn - Pure Tin Application: Matte/Satin Finish: Reel-to-reel plating of semiconductor lead frames, connectors, contacts, wire, flat stock. Rack and barrel plating of connectors, contacts and miscellaneous parts. |
• low foaming> • large grain size • low stress • great tarnish resistance in high temperature applications • superior throwing power and thickness distribution • high process temperature stability up to 140°F • very low carbon content • excellent solderability |
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| 2544LF-P/ 2544LF-S |
100% Sn - Pure Tin Application: Matte/Satin Finish: Reel-to-reel plating of semiconductor lead frames, connectors, contacts, wire, flat stock. Rack and barrel plating of connectors, contacts and miscellaneous parts |
• low foaming • two component additive system • maximum process control • control grain size from 1 to 10 microns • very wide current density range • excellent solderability |
| BPT-10 | 100% Sn - Pure Tin> Application: Bright Finish: Reel-to-reel plating of connectors and contacts |
• low foaming • wide bright plating range • high temperature stability up to 100°F • good solderability • high cathode efficiency |
| 2062 | 100% Sn Application:Matte/Satin Finish: Rack plating of printed circuit boards and miscellaneous parts. Barrel plating of connectors, contacts and discrete components |
• stable alloy and thickness distribution • uniform deposit appearance • low carbon content • excellent solderability • great throwing power |
| 2175 | 100% Sn - Pure Tin Application: Bright Finish: Reel-to-reel plating of connectors and flat stock. Rack and barrel plating of connectors, contacts, discrete components and miscellaneous parts. |
• good solderability • wide current density range • robust process |
| FGT-200 | 100% Sn - Pure Tin Application: Matte/Satin Finish: Reel-to-reel plating of semiconductor lead frames, connectors, contacts, wire, flat stock. Rack and barrel plating or connectors, contacts and miscellaneous parts. |
• fine grained Tin deposit • reduced flaking in fine pitch trim and form operations • excellent solderability • very fast wetting speeds even at low reflow temperatures • whiter deposit • low foaming • low stress • very low carbon content • additives are analyzable • Grain size from 1 to 3 microns, depending on application |
| FGT-300 | 100% Sn - Pure Tin Application: Matte/Satin Finish: Reel-to-reel plating of semiconductor lead frames, connectors, contacts, wire, flat stock. Rack and barrel plating of connectors, contacts and miscellaneous parts |
• finest grained Tin deposit • essentially eliminates flaking in fine pitch trim and form operations • excellent solderability • fastest wetting speeds even at low reflow temperatures • whitest deposit • low foaming • low stress • low carbon content • additives are analyzable • grain size of less than 1 micron depending on application |
| RBM-100 | 100% Sn - Pure Tin Application: Matte/Satin Finish: Rack and barrel plating of connectors, contacts and miscellaneous parts. |
• best throwing power and covering power for rack and barrel plating • optimal for complex and very small components plating • white fine grained deposit • excellent solderability • low carbon content • additives are analyzable |
| Sulfate Based Pure Tin Technology | ||
| 2800 | Pure Tin Application: Matte/Satin Finish: Rack and barrel plating of connectors, contacts and miscellaneous parts. |
• excellent solderability and reflow • uniform, fine-grained deposit • low to no foam process • superior throwing power • easy to maintain and control |
| Fluoborate Based Pure Tin Technology | ||
| 2190 | Tin-lead - Pure Tin Application: Matte/Satin Finish: Reel-to-reel plating of connectors and flat stock. Rack and Barrel plating of connectors, contacts, discrete components and miscellaneous parts. |
• Pure Tin to 60 40 Tin-Lead • low speed and high speed • excellent solderability • uniform appearance and alloy |
| 2147 | Pure Tin Application: Matte/Satin Finish: Immersion Tin plating of electronic components, internal coating of pipes. |
• Lead free technology • exceptional throwing power • excellent solderability • low temperature operation |
