Electronic Chemicals
Printed Circuit Board
Outer Layer Processes
Outer layer Strip Etch Strip
The company markets a variety of photoresist and metal strippers. The products are:
Electro-Brite Resist Stripper RS-8014Q is a concentrated aqueous solution formulated to strip aqueous and semi-aqueous dry film resists, liquid photoimageable resists and alkaline soluble, screen printed resists. The RS-8014Q can be used in spray or immersion and is of low alkalinity. Thus it will not attack or darken tin or tin-lead etch resists.
Electro-Brite Resist Stripper RS-8027Q is a concentrated aqueous solution formulated to strip aqueous and semi-aqueous dry film resists, liquid photoimageable resists and alkaline soluble, screen printed resists. The RS-8027Q can be used in spray or immersion. Due to the relatively low pH of the working solution, the RS-8027Q will not attack tin or tin/lead etch resists. Resist Stripper RS-8027Q efficiently strips resist while leaving the copper surface clean and free of oxidation.
The Electro-Brite Solder Stripper 818/819 Process is a two step process specifically engineered for the removal of tin or tin/lead deposits from printed wiring boards.
The first step utilizes Electro-Brite Solder Stripper 818 to strip the bulk of the deposit. This step utilizes a nitric acid based solution, 818-A, inhibited to nearly eliminate attack on the base copper
Electro-Brite Solder Stripper 890 is an acidic, ferric nitrate based solder stripper designed for use in printed circuit board fabrication operations for removal of solder and tin deposits from copper substrates.
Electro-Brite Sol Strip 150/S1S is a highly stabilized hydrogen peroxide based solder stripper, designed to be used in spray and immersion applications to remove tin and tin/lead deposits with minimal attack on the copper substrate.
