Electronic Chemicals
Market Segments
Electronic Packaging and Finishing Technologies
Our line of chemistries for electronics and metal finishing applications includes next-generation lead-free solder plating processes as well as traditional tin-lead soldering technologies and base metal plating processes. Our expertise in formulating advanced plating additives has secured our position as a global leader in the development of specialized plating technologies for use in the electronics, aerospace, military and general metal finishing industries. Our processes are used in the plating of semiconductor leadframes, connectors, wire, flat stock, sheet steel and discrete components such as resistors, capacitors and diodes. Our processes can be used in high-speed reel-to-reel applications as well as in conventional rack and barrel plating.
General Metal Finishing
OMG has been making high-purity electroless nickel concentrates for more than 20 years. We started making high-phosphorus electroless nickel for the memory disk industry, and have since branched out to many other types of electroless nickel processes for a variety of markets and applications, including aerospace, automotive, avionics, electronics, mold/tool/die, petrochemical, surgical and textile. Currently, we manufacture a variety of high-, medium- and low-phosphorus electroless nickel products that meet ASTM standards, in addition to RoHS- and ELV-compliant lead and cadmium-free components. We also make composite electroless nickels with co-deposit materials such as PTFE and silicon carbide for certain applications. All of our electroless nickel concentrates are 100% performance tested prior to shipment.
Memory Disk
For more than 20 years, OMG has been supplying electroless nickel solutions and preplate chemistries to the computer and consumer electronics industries, for the manufacture of hard drive memory disks used for memory and data storage applications. We are the global leader in the supply of these products to the hard drive industry. Memory disk applications include computer hard drives, digital video recorders, MP3 players, digital cameras, and business and enterprise servers. We specialize in the development and manufacture of products specifically designed to operate under the strictest requirements in terms of deposit properties, environmental regulations and RoHS specifications, and product defect limits.
Our expertise lies in our ability to develop products that are equal to the ever-increasing demands placed on memory disk performance for increased storage capacity, economies and the elimination of sub-micron defect levels. With more than 40 years’ combined experience in R&D and engineering support to the memory disk industry, OMG continues to lead the way in new product development and technological innovations for hard disk drive applications.
Printed Circuit Chemistry
OMG Electronic Chemicals is rapidly expanding our product offering in this market segment. This includes a complete line of specialty chemicals and processes used in fabrication of complex printed circuit boards and solar cells. The company organizes its product line around the key unit operations in a printed circuit board fabrication facility. These include inner-layer fabrication, making holes conductive, outer-layer technology and final finishes. OMG Electronic Chemicals is at the forefront in providing leading edge and state-of-the-art process technology making a close connection to our direct customer as well as our customer’s customer. Our extensive intellectual property portfolio allows us to compete on a worldwide basis and meet the needs of our customers. Our processes are used in the fabrication of printed circuits boards for the aerospace, military, automotive, computer, telecom, consumer, industrial and instrumentation industries.
OMG products are well recognized brand names that include: CO-BRA ETCH® microetchng, SHADOW® Direct Metalization, CO-BRA BOND ® Oxide Alternative and Perma-etch® Final Etching Technology. We also market a complete line of final finishes designed to enhance the soderability of critical surfaces. Our ENIG, Selective ENIG, Immersion Silver, Immersion Tin and Lead-free compatible OSP provide both fabricators and end users with cost effective and highly reliable solutions for the most complex circuit board assemblies. Rounding out the product portfolio, OMG Electronic Chemicals develops and markets specialty niche processes and a full range of electroplating chemistries. This includes pulse copper plating, high aspect ratio acid copper, via fill technology and semi-bright tin plating processes. We provide solutions for the most dense circuit designs that include specialty resist and metal strippers, developers and specialty surface cleaners.
