Electronic Chemicals
Printed Circuit Board
Final Finishes
Electroless Nickel Immersion Gold Process
The Electroless Nickel Immersion Gold (ENIG) process has been designed to eliminate skip and stray plating usually associated with many other systems. In addition, the Electroless Nickel chemistry has been designed with a stabilizer package that eliminates “black pad” failures.
| OMG 9023SFX | Very Low Surface Tension Acid Cleaner |
| OMG 9223 | Alternative Acid Cleaner to eliminate ENIG plating in Non-plated- through-holes. |
| OMG 9024 | Micro-etch |
| OMG 9055 | Alternative Micro-etch |
| OMG 9025M | Chloride-Free Activator |
| OMG 9026M | Electroless Nickel |
| OMG 9027SG | Low Gold Content Immersion Bath (0.5 g/l metal) |
| OMG 9027R | Optional Gold Rate Enhancer |
Totally Lead-Free/CAD-Free Nickel for ENIG, as well as Immersion Silver and Immersion Tin.
| OMG 9126LF | Electroless Nickel drop-in to current ENIG system. |
OMG 9099MS Tin
| OMG 9023SFX | Very low surface tension Acid cleaner |
| OMG 9055 | Etch |
| OMG 9099MS | Tin Concentrate |
| OMG 9099ICE | Contamination Neutralizer |
OMG Fidelity SSP 108 Silver
| OMG 9023SFX | Very low surface tension Acid cleaner |
| OMG 9055 | Micro-etch |
| OMG SSP 108PX | Silver Pre Dip |
| OMG SSP 108 | Silver Bath |
| OMG Anti tarnish | For increased Shelf life |
Electro-Brite M-Tin is a clear immersion tin designed and formulated to coat a copper substrate or solder deposit with a dense tin deposit.
Shikoku Glicoat SMD F2LX is an acetic acid based solution containing a substituted imidazole that is designed to produce a thin organic coating on copper while leaving gold plated connectors essentially coating-free. The Glicoat SMD F2LX is especially suited for lead-free assembly.
Silver Guard 950 is an immersion process for silver designed to deposit 8-12 microinches.
Defoamers
Our PD-550 is an efficient non-silicone based defoamer that is particularly used in dry film / ink stripping and photo-imageable solder mask developing. Specifically formulated to resolve foam problem, its formulation is ideal for use in conveyorized spraying machines without adversely affecting the equipment.
