Electronic Chemicals
Printed Circuit Board
OMG Chemistry
| Defoamers | |
| Our PD-550 is an efficient non-silicone based defoamer that is particularly used in dry film / ink stripping and photo-imageable solder mask developing. Specifically formulated to resolve foam problem, its formulation is ideal for use in conveyorized spraying machines without adversely affecting the equipment. | |
| Cleaners | |
| 9023SFX | Very Low Surface Tension Acid Cleaner |
| 9223 | Aggressive NPTH Cleaner for ENIG |
| Plated Through-Hole (PTH) Products | |
| 1012 | Alkaline Cleaner/Conditioner |
| 1014 | Peroxide/Sulfuric Micro-etch |
| 1017 | Activator Pre-Dip |
| 1018 | Activator |
| 1019 | Accelerator |
| 1021F | Electroless Copper Reducer |
| 1025 | Room Temperature Electroless Copper |
| 1080 | Tarnish Inhibitor |
| 1120 | High Speed Electroless Copper |
| Acid Copper / Tin Plating | |
| DES Chemistry | |
| The Develop Etch Strip (DES) process comprises of the Developer PD-610, Ammonia Etchant and Dry Film Stripper. Developer PD-610 has been developed to replace the conventional method of photo-resist / liquid photo imageable solder mask using sodium carbonate. PD-610 increases the bath life and enhances the developing efficiency. Dry Film Stripper PD-3503 / PD-3506 is an aqueous solution formulated for high speed removal of all type alkaline dry film photo resist. It will not activate or darken tin surfaces, leaving copper surfaces bright and untarnished. Ammonium Etchant is an alkaline etching chemistry for the manufacturing of high quality printed through hole, or print and etch type PCB. It features consistent high etching rate. |
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| Electroless Nickel Immersion Gold Process | |
| The Electroless Nickel Immersion Gold (ENIG) process has been designed to eliminate skip and stray plating usually associated with many other systems. In addition, the Electroless Nickel chemistry has been designed with a stabilizer package that eliminates “black pad” failures. |
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| OMG 9023SFX | Very Low Surface Tension Acid Cleaner |
| OMG 9223 | Alternative Acid Cleaner to eliminate ENIG plating in Non-plated- through-holes. |
| OMG 9024 | Micro-etch |
| OMG 9055 | Alternative Micro-etch |
| OMG 9025M | Chloride-Free Activator |
| OMG 9026M | Electroless Nickel |
| OMG 9027SG | Low Gold Content Immersion Bath (0.5 g/l metal) |
| OMG 9027R | Optional Gold Rate Enhancer |
| Totally Lead-Free/CAD-Free Nickel for ENIG, as well as Immersion Silver and Immersion Tin. | |
| OMG 9126LF | Electroless Nickel drop-in to current ENIG system. |
| OMG 9099MS Tin: | |
| OMG 9023SFX | Very low surface tension Acid cleaner |
| OMG 9055 | Etch |
| OMG 9099MS | Tin Concentrate |
| OMG 9099ICE | Contamination Neutralizer |
| OMG Fidelity SSP 108 Silver: | |
| OMG 9023SFX | Very low surface tension Acid cleaner |
| OMG 9055 | Micro-etch |
| OMG SSP 108PX | Silver Pre Dip |
| OMG SSP 108 | Silver Bath |
| OMG Anti tarnish | For increased Shelf life |
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