Electronic Chemicals
Electronic Packaging and Finishing Technologies
OMG Tin-Lead Alloy Plating Processes
| Process | Alloy | Feature/Benefit |
| Methane Sulfonate Based Technology | ||
| 2540 | 97/3 Sn/Pb to 60/40 Sn/Pb to 100% Lead> Application: Matte/Satin Finish: Reel-to-reel plating of semiconductor lead frames, connectors, contacts, wire, flat stock. Rack and barrel plating of connectors, contacts and miscellaneous parts. |
• high cathode efficiencyn • low foaming • low carbon content • fine-grained deposit • superior thickness and alloy distribution • very wide alloy application range • high temperature stability to 140°F • excellent solderability |
| BTL | 97/3 Sn/Pb to 80/20 Sn/Pb Application: Bright Finish: Reel-to-reel plating of connectors and contacts. |
• low foaming • high temperature stability up to 95°F • good solderability • high cathode efficiency |
| 2062 | 100% Sn to 60/40 Sn/Pb Pb/Sn/Cu> Application: Matte/Satin Finish: Rack plating of printed circuit boards and miscellaneous parts. Barrel plating of connectors, contacts and discrete components. |
• stable alloy and thickness distribution • uniform deposit appearance • low carbon content • excellent solderability • great throwing power |
| 100% Sn to 60/40 Sn/Pb> Application: Matte/Satin Finish: Rack and barrel plating of connectors, contacts and miscellaneous parts. |
• best throwing power and covering power for rack and barrel plating • optimal for complex and very small components plating • white fine grained deposit • excellent solderability • low carbon content • additives are analyzable |
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| 1957 | 97/3 Sn/Pb to 80/20 Sn/Pb Application: Matte/Satin Finish: Rack and barrel plating of connectors, contacts and discrete components. |
• superior throwing power and thickness distribution in critical barrel plating applications #8226; excellent solderability |
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