Electronic Chemicals

Electronic Packaging and Finishing Technologies

Base Metal Processes
Electronic Grade Methane Sulfonate Concentrates
Electronic Grade Base Metal Concentrates
Lead Free Plating Processes
Pre-Plate and Post-Plate Processes
Tin-Lead Alloy Plating Processes

OMG Pre-Plate and Post-Plate Processes

Product Code	Classification/Description	Feature/Benefit
Semiconductor Process Line Technology
PED-2020	Electrolytic Deflash Specially formulated to readily loosen mold flash and resin bleed on plastic semiconductor leadframe packages electrolytically. Can also be used as a degreaser to remove oil, wax, dirt and finger prints on electronic components.	• does not attack the base metal • prevents re-deposition of Metallic contaminants • low foaming solution • silicate free
PCD-6100	Immersion Deflash This product is specifically formulated to remove the epoxy compound residue left on the leadframe after the plastic molding process without attacking the base metal.	• does not require mechanical deflashing after process • low odor • high ignition point of 450°C • low COD
PCD-6300 PCD-6300R	Descaler Acidic descaling chemical designed to produce an active surface on a wide variety of metals including copper, beryllium copper and other copper alloys. Ideal for use in strip-to-strip semiconductor plating applications.	• does not attack C7025 material • rinses off easily • no Ammonium ions of chelating agents, easy waste treatment • easy to use
PMES-1195	Micro-Etching Salt Mild acidic micro-etching formula specifically designed to produce an active surface on a wide variety of metals, especially copper, beryllium copper and copper alloys. Highly recommended for use on semiconductor leadframes in strip-to-strip plating equipment.	• controlled etch rate • easy to rinse • useful in both Immersion and Spray systems • no ammonium ions of chelating agents, easy waste treatment. • easy to use
PS-389	Immersion or Spray Belt Stripper This nitric acid based stripper is specially designed to strip pure tin or tin-lead from strip-to-strip plating equipment belts, but can also be used for stripping deposits from parts or racks. Can be used on immersion solution or in a spray mode.	• contains no fluoride • very high metal holding capacity, greater than 120 g/l • rapid stripping rate • sludge free • easy maintenance of equipment
PS-3900	Electrolytic Belt Stripper The specially formulated belt stripper is ideal for electrolytic stripping of tin and tin-lead deposits from stainless steel strip-to-strip semiconductor equipment plating belts.	• minimal attack on the stainless steel belts • minimal sludge • very simple to use and control • long bath life
PPE-1149	Soak / Electrocleaner This specially formulated silicate-free non-foaming electrocleaner is very effective in removing cutting, de-rusting and stamping oils, as well as drawing oils on most base metals and at very short time at low voltage.	• easy to use and control • non-foaming • silicate free • easy to rinse • very economical to use
PLE-1190MU PLE-1190MR	Soak / Electrocleaner Very effective soak and electro-cleaner for removal of heavy oils from steel, nickel, copper and copper alloys after forming. This product is perfect for removal of stamping oils on leadframes using high speed reel-to-reel plating equipment.	• low foaming • borax and silicate free • use both as a soak and electrocleaner • very wide operating window
PAA-1192 PAA-1194	Acid Activator Acid based activator for use in activating semiconductor leadframes and similar electronic components. Base metals that can be activated include copper, copper alloys, steel, stainless steel, aluminum, Alloy 42 and Kovar.	• highly concentrated • ensures superior adhesion of plated metals onto base metal • produces bright, clean smut-free surfaces • non-fuming • excellent oxide remover
Other Technology
PCE-4202	Plus Cu Etch Alkaline etching for copper base substrate	• high speed etching up to 40 - 50 micron/min • wide operating window
PGSA-3100	Gold Stripper Special Blend additives for gold stripping	• up to 2.5 micron/min stripping rate • can hold up to 20 g/l in working solution • non attack on base nickel substrate • easy to use and handle, as it is in solution form
PS-3910	Electrolytic Belt stripper (Ni) The specially formulated belt stripper is ideal for electrolytic stripping of nickel, palladium and copper deposits from stainless steel strip-to-strip semiconductor equipment plating belts with minimum attack.	• minimal attack on the stainless steel belts • minimal sludge • very simple to use and control • long bath life