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Electronic Chemicals

Electronic Packaging and Finishing Technologies

• Base Metal Processes
• Electronic Grade Base Metal Concentrates
• Electronic Grade Methane Sulfonate Concentrates
• Lead Free Plating Processes
• Pre-Plate and Post-Plate Processes
• Tin-Lead Alloy Plating Processes

OMG Base Metal Processes

Process	Deposit	Application	Description	Feature/Benefit
Nickel and Nickel Alloy Technology
5000	Nickel Nickel/Cobalt	Reel-to-Reel Rack and Barrel	Matte / Satin Deposit	• low stress • high ductility • very wide current density range • excellent corrosion resistance • superior throwing power
3760	Nickel	Rack and Barrel	Matte / Satin Deposit	• anti-Pitter • effective at Low Concentration • Analyzable
B4	Nickel	Reel-to-Reel Rack and Barrel	Semi-bright to Bright Deposit	• stress reducer • hardener • controlled stress and hardness • additive is analyzable
161	Kovar	Immersion Descaler	Acid Based Descaler	• ready to use • controllable by Hydrometer